Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Maxim Integrated Produc... |
90-0167
|
25Kb / 1P |
PACKAGE LAND PATTERN, (E16) 0.150 QSOP, 16 LEADS
Rev A |
Integrated Circuit Syst... |
MK2761A
|
142Kb / 6P |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
List of Unclassifed Man... |
TO263
|
90Kb / 2P |
Package Outline Drawing Transistor Outline
|
ACCUTEK MICROCIRCUIT CO... |
AK06D300-QSOP
|
174Kb / 4P |
Quarter Size Small Outline Package QSOP DIP Adapters
|
Analog Devices |
R-8
|
153Kb / 1P |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Maxim Integrated Produc... |
21-0066
|
42Kb / 1P |
PACKAGE OUTLINE, TSSOP 4.40MM BODY
Rev L |
Analog Devices |
HMC253AQS24
|
526Kb / 5P |
24 Lead QSOP Package
|
TT Electronics. |
R-2R
|
456Kb / 2P |
QSOP Package - Small Footprint
|
Fairchild Semiconductor |
MKT-MO8A
|
215Kb / 1P |
8LD SOIC JEDEC MS-012 0.150 NARROW BODY
|
Maxim Integrated Produc... |
21-0108
|
71Kb / 2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
Rev K |