Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Honeywell Solid State E... |
SS94A1
|
64Kb / 1P |
CENTERLINE OF HALL CELL ONLY THELOCATION OF CERAMIC COVER IS SPECIFIED
|
SS94A2D
|
66Kb / 1P |
CENTERLINE OF HALL CELL ONLY
|
Tiger Electronic Co.,Lt... |
LT10.7MS2
|
460Kb / 8P |
This specification shall cover the characteristics of the ceramic
|
Wurth Elektronik GmbH &... |
784787120
|
589Kb / 7P |
It is recommeded that the temperature of the component does not exceed
|
784787101
|
589Kb / 7P |
It is recommeded that the temperature of the component does not exceed
|
784787121
|
589Kb / 7P |
It is recommeded that the temperature of the component does not exceed
|
Japan Aviation Electron... |
FO-FC-RS-A2-R
|
110Kb / 1P |
THE SHAPE OF INDICATED RADIUS PART IS NOT STRICT REQUIREMENT
|
NXP Semiconductors |
MC56F826XXDS
|
1Mb / 60P |
The following table is the comparsion of features among members of the family.
Rev. 0, 08/2018 |
STMicroelectronics |
UM1865
|
1Mb / 132P |
The purpose of this document is to describe the design of the application
|
UM1755
|
1Mb / 123P |
The purpose of this document is to describe the design of the application
|