1. Product Overview:

️· Type: MOS Dynamic Read-Only Memory (DRAM). This is a DRAM chip, meaning it needs constant refreshing.
️· Capacity: 1024 x 16 = 16Kbit (though it's addressed as 1024 x 8 in some contexts)
️· Organization: Organized for byte-addressable access.
️· Intended Use: General-purpose electronic equipment for commercial applications. NOT intended for safety-critical applications (automotive, medical, aerospace, etc.).

2. Electrical & Performance Characteristics:

️· Supply Voltage (Vcc): Specification not explicitly mentioned here, but it's standard for DRAMs of this era.
️· Operating Temperature: Specification not explicitly mentioned, but typically -40°C to +85°C for commercial grade.
️· Refresh Requirements:
- Self-Refresh Mode: No external refresh control needed. This simplifies circuit design.
- Auto-Refresh Mode: Requires 1024 refresh cycles within 100ms.
️· Access Time: Specification not given directly but “Fast Access Mode” is available by keeping the FAM pin low.
️· Fast Access Mode (FAM): Provides faster read/write cycles if the FAM pin is held low, adhering to specific timing requirements (tFS and tSS - not detailed in the document). *Crucially, a normal cycle is needed afterward to increment the X address.*

3. Pin Functions (Key Ones):

️· A0-A9: Address lines (for selecting memory location).
️· D0-D7: Data input/output lines.
️· R/W: Read/Write control signal.
️· CS: Chip Select (enables/disables the chip).
️· RS/A: Self-Refresh/Auto-Refresh select. Determines refresh mode.
️· RFSH: Refresh Clock input (used in Auto-Refresh mode).
️· FAM: Fast Access Mode select.
️· TEST: Fixed high. Used internally during manufacturing.
️· D0-D7: Bi-directional data lines. High impedance when not selected (CS = High)

4. Key Operating Considerations & Special Features:

️· Power-Up Sequence: A critical detail. After applying power (Vcc), there is a 100ms stabilization period *before* normal operation. Followed by at least 8 RW cycles to initialize the memory.
️· Fast Access Mode (FAM): While offering improved speed, it requires careful implementation. It is dependent on specific timing.
️· Data Output: The output pins are in a high-impedance state when the chip is not selected. Allows for easy parallel connection of multiple MSM63V89C chips.
️· Memory Retention: Dependent on Vcc and temperature. (Specific retention times are not listed).
️· Package: TSOPII26/20-P-300-1.27-K. Surface mount. Requires care in handling and reflow soldering.

5. Important Notes & Warnings:

️· Non-Safety Critical: The device is specifically not approved for use in life-critical applications.
️· Export Restrictions: Possible government approval needed for export to certain countries.
️· Intellectual Property: No intellectual property rights granted for use.
️· Liability: Oki disclaims liability for misuse, improper handling, or failure to adhere to specifications.
️· Refresh Cycles: Must be performed in Auto Refresh mode within 100ms.