1. Device Overview: AMMC-3040

️· Type: High-performance monolithic microwave integrated circuit (MMIC) mixer.
️· Function: Versatile mixer, capable of operating as a frequency doubler/multiplier or a fundamental frequency mixer.
️· Manufacturer: Avago Technologies.
️· Key Features:
- Low conversion loss.
- High isolation.
- Versatile biasing options for different mixer modes.
- Designed for ease of integration.

2. Electrical Characteristics & Performance (Specific values are not provided, but operating conditions are detailed)

️· Operating Modes:
- Fundamental Frequency Mixer: All four FET stages used for mixing.
- Sub-Harmonic (Frequency Doubler/Multiplier): First stage biased at pinch-off to generate harmonics; remaining stages amplify.
️· Biasing:
- Fundamental Mode:
■ All four drain connections to a single 3.5-4.5V supply.
■ Adjustable negative supply voltage for the four gates (total drain current typically 150-250mA).
- Sub-Harmonic Mode:
■ First stage FET biased at pinch-off (Vg1 ≈ -1.1V).
■ Remaining three stages biased for normal amplification (I d2 + I d3 + I d4 ≈ 250mA).
■ Drain voltage (Vdd) for all stages: 3.5-4.5V.
️· Input/Output Ports:
- IF Output: Located near the middle of the die; AC-coupled. Requires a 20-mil (500 µm) bond wire to a 0.6 pF shunt capacitor.
- RF/LO Inputs: Ground-Signal-Ground configuration.
- RF Input: DC voltage must be below 1V or a blocking capacitor is needed.

3. Assembly & Mechanical Considerations

️· Die Thickness: 100 µm.
️· Backside: RF ground.
️· Attachment:
- Microstripline: Attach directly to a ground plane using electrically conductive epoxy.
- Coplanar Circuits: Mount directly on the ground plane with multiple vias for heat sinking.
️· Mechanical Precautions:
- Avoid exposing air bridges on the top surface.
- Handle with care; static-sensitive device; use ESD precautions.
- Do not use eutectic attachment.
️· Bonding Techniques:
- Thermosonic wedge bonding is preferred.
- Gold mesh attachment (2 mil tracking tool, specific ultrasonic power levels).
- Recommended bond stage temperature: 150 ± 2°C.
️· Bond Pad Layout: Figure 15 shows the layout of RF, LO, and IF bond pads.

4. Ordering Information

️· AMMC-3040-W10 = 10 devices per tray
️· AMMC-3040-W50 = 50 devices per tray

5. Key Notes & Recommendations

️· Use bypass capacitors (Cb ≥ 100 pF) for stable operation.
️· Keep RF connections as short as possible.
️· For sub-harmonic mixing, the input power level should be 3-8 dBm.
️· Refer to Figure 16 for assembly diagrams (fundamental and sub-harmonic modes).

In essence, the AMMC-3040 is a highly configurable MMIC mixer that requires careful attention to biasing and assembly techniques to achieve optimal performance.