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  • Part No.160240
    ManufacturerOSA
    Size53 Kbytes
    Pages1 page
    DescriptionGaP / GaP LED Chips
    Datasheet Summary with AI

    # YELLOW-GREEN LED Chips - Item No.: 160240

    ## Product Specifications

    · Applies to GaP / GaP LED Chips.

    ## Structure

    · Mesa Structure: Employed in chip design.
    · Electrodes:
    - p-side (anode): Au alloy
    - n-side (cathode): Au alloy

    ## Dimensions (microns)

    · Dimensions available in table format within the datasheet. Wire bond contacts can be circular or square.

    ## Electrical and Optical Characteristics (T=25°C)

    | Parameter | Symbol | Conditions | Min | Typ | Max | Unit |

    |---|---|---|---|---|---|---|
    | Forward Voltage | VF | IF = 20 mA | 2.25 | 2.50 | V |
    | Reverse Current | IR | VR = 5 V | | | 10 | µA |
    | Luminous Intensity * | IV | IF = 20 mA | 10.0 | 13.5 | mcd |
    | Peak Wavelength | λP | IF = 20 mA | | 568 | nm |

    · *Wafers can be delivered according to luminous intensity classes upon request.
    · Brightness measurement at OSA on gold plate.

    ## Packing

    · Dice on adhesive film:
    - 1) Wire bond side on top
    - 2) Back contact on top

    ## Labeling

    · Includes: Type, Lot No., I V typ, Quantity, min, max.

    # YELLOW-GREEN LED Chips - Item No.: 160240

    ## Product Specifications

    · Applies to GaP / GaP LED Chips.

    ## Structure

    · Mesa Structure: Employed in chip design.
    · Electrodes:
    - p-side (anode): Au alloy
    - n-side (cathode): Au alloy

    ## Dimensions (microns)

    · Dimensions available in table format within the datasheet. Wire bond contacts can be circular or square.

    ## Electrical and Optical Characteristics (T=25°C)

    Parameter Symbol Conditions Min Typ Max Unit
    Forward Voltage VF IF = 20 mA 2.25 2.50 V
    Reverse Current IR VR = 5 V 10 µA
    Luminous Intensity * IV IF = 20 mA 10.0 13.5 mcd
    Peak Wavelength λP IF = 20 mA 568 nm

    · *Wafers can be delivered according to luminous intensity classes upon request.
    · Brightness measurement at OSA on gold plate.

    ## Packing

    · Dice on adhesive film:
    - 1) Wire bond side on top
    - 2) Back contact on top

    ## Labeling

    · Includes: Type, Lot No., I V typ, Quantity, min, max.

    Part No.160240
    ManufacturerOSA
    Size53 Kbytes
    Pages1 page
    DescriptionGaP / GaP LED Chips
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