Overall Document Context

️· Document Title: Specification for Approval
️· Document ID: SR3F0000NH
️· Revision: A0

1. General Specifications (Page 1-2)

️· Power Rating: 1/3 W
️· Resistance Range: 0.010Ω ~ 0.050Ω
️· Resistance Tolerance: ±1%, ±2%, ±5% (Multiple tolerance options)
️· Temperature Coefficient of Resistance: 0~250ppm/℃

2. Testing and Performance (Pages 3-5)

This section details the testing procedures and acceptable results (ΔR - change in resistance) based on JIS standards (Japanese Industrial Standards).

Test Item	Condition	Requirements (ΔR)
Short Time Overload	2.5 * Rated power for 5 seconds (JIS C 5201-1 4.13)	± (0.5% + 0.0005Ω)
Insulation Resistance (Requires specific mounting)	Test voltage: 100± 15VDC for 1 minute (JIS C 5201-1 4.6)	Between Electrode and Protection Film: 100MΩ or over; Between Electrode and Substrate: 1,000MΩ or over
Voltage Proof	Voltage: 100VAC (RMS) for 1 minute (JIS C 5201-1 4.7)	± (0.5% + 0.0005Ω)
Thermal Shock	-55°C to 125°C, 5 cycles, 15 minutes at each extreme (JIS C 5201-1 4.19)	± (1.0% + 0.0005Ω)
Low Temperature Storage	-55°C, 1000 hours (JIS C 5201-1 4.23.4)	± (1.0% + 0.0005Ω)
High Temperature Exposure	125°C, 1000 hours (JIS C 5201-1 4.23.2)	± (1.0% + 0.0005Ω)
Solderability	Solder Temperature: 245± 5°C; Immersion Time: 2± 0.5 seconds (JIS C 5201-1 4.17)	Minimum 95% surface coated
Resistance to Soldering Heat	Dipped in solder: 270± 5°C for 10± 1 seconds (JIS C 5201-1 4.18)	± (0.5% + 0.0005Ω); No distinct deformation
Load Life	Rated Voltage for 1.5 hours, followed by a 0.5-hour pause at 70± 2°C. Cycle repeated 1000 times (JIS C 5201-1 4.25)	± (1.0% + 0.0005Ω)
Damp Heat with Load	60± 2°C, 90% to 95% Relative Humidity, 1.5 hours ON, 30 minutes OFF. Cycle repeated 1000 times (JIS C 5201-1 4.24)	± (1.0% + 0.0005Ω)
Mechanical Shock	100 G’s for 6 milliseconds, 5 pulses (JIS C 5201-1 4.21)	± (0.5% + 0.0005Ω)
Bending Test	Glass-Epoxy board thickness: 1.6mm; Bending width: 2mm; Fulcrum distance: 90mm (JIS C 5201-1 4.33)	±(0.5% + 0.0005Ω)

3. Dimensional Specifications (Page 1 & 6)

️· Values for a, b, c, and f: These are part of a dimensional table likely representing sizes or locations on the component. The table presented in the last page (page 6) does not seem to contain complete information; this should be regarded as just an attempt to represent some data, or part of a table that got cut off.

4. Packaging and Identification (Page 4 & 8)

️· Pre-empted Holes: 150 holes (or 30cm) or more.
️· Code Letter Dimensions:
- A: 1.45± 0.10
- B: 2.25± 0.10
️· Packaging Identification: The packaging must include:
- Quantity
- Manufacturing Date Code
- Manufacturer's Name
- Country of Origin

Key Considerations and Potential Inconsistencies:

️· Table on Page 6: The table on page 6 appears incomplete, or possibly intended as part of a larger schematic or design reference.
️· JIS Standards: The document heavily relies on JIS standards, which are likely essential for full compliance. Referencing the full JIS documents is crucial for detailed requirements.
️· Missing Data: The dimensional specifications are fragmentary, and more information would be needed for a complete understanding.