FLEXSPI Datasheet(PDF) - RT600_V02

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
NXP Semiconductors	RT600	5Mb/171P	Dual-core microcontroller with 32-bit Cortex®-M33 and Xtensa HiFi4 Audio DSP CPUs; Up to 4.5 MB SRAM; FlexSPI with cache and dynamic decryption; High-speed USB device/host Rev. 2.1 - 7 July 2023
	RT600	6Mb/167P	Dual-core microcontroller with 32-bit Cortex짰-M33 and Xtensa HiFi4 Audio DSP CPUs; Up to 4.5 MB SRAM; FlexSPI with cache and dynamic decryption; High-speed USB device/host + Phy; 12-bit 1 Msamples/s ADC; Analog Comparator; Audio Rev. 2.0-1 April 2022
	LPC553X	4Mb/161P	32-bit Arm Cortex짰-M33, 128 KB SRAM; 256 KB flash, FlexSPI with cache, USB FS, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, 16-bit 2.0 Msamples/sec ADC, Comparator, 12-bit DAC, OpAmp, FlexPWM Timer, QEI, Temperature Sensor, CRC Rev. 1.0 ??04/2022
	LPC553X	3Mb/163P	32-bit Arm Cortex®-M33, 128 KB SRAM; 256 KB flash, FlexSPI with cache, USB FS, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, 16-bit 2.0 Msamples/sec ADC, Comparator, 12-bit DAC, OpAmp, FlexPWM Timer, QEI, Temperature Sensor, CRC Rev. 2.0 - 11 October 2022
	LPC553X	10Mb/165P	32-bit Arm Cortex®-M33, 128 KB SRAM; 256 KB flash, FlexSPI with cache, USB FS, Flexcomm Interface, CAN FD, 32-bit counter/ timers, SCTimer/PWM, 16-bit 2.0 Msamples/sec ADC, Comparator, 12-bit DAC, OpAmp, FlexPWM Timer, QEI, Temperature Sensor, CRC Rev. 4.0 - 18 April 2023

FLEXSPI Datenblatt, PDF