| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd.
|
1719720119 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.38關m Selective Gold (Au) Plating, 19 Circuits |
| 1719720124 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.38關m Selective Gold (Au) Plating, 24 Circuits |
| 1719720207 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.75關m Selective Gold (Au) Plating, 7 Circuits |
| 1719720211 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.75關m Selective Gold (Au) Plating, 11 Circuits |
| 1719720216 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.75關m Selective Gold (Au) Plating, 16 Circuits |
| 0901522140 |
29Kb/2P |
2.54mm Pitch C-Grid III PC Board Connector, Dual Row, Right Angle, Straight PCB Pins 1.00關m Tin (Sn), 40 Circuits |
| 0874272448 |
43Kb/2P |
Mini-Fit Jr. Header, 4.20mm Pitch, Vertical, Nylon, without Flange, 24Circuits, 0.76關m Gold (Au) over Nickel (Ni) Plating, Bulk Packaging |
| 1719720103 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.38關m Selective Gold (Au) Plating, 3 Circuits |
| 1719720105 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.38關m Selective Gold (Au) Plating, 5 Circuits |
| 1719720121 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.38關m Selective Gold (Au) Plating, 21 Circuits |
| 1719720122 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.38關m Selective Gold (Au) Plating, 22 Circuits |
| 1719720206 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole with Pegs, 0.75關m Selective Gold (Au) Plating, 6 Circuits |
| 1719720218 |
46Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Through Hole, with Pegs, 0.75關m Selective Gold (Au) Plating, 18 Circuits |
| 0010897122 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 12 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897662 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 66 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897280 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897742 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 74 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897360 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 36 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897640 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 64 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897382 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 38 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
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