| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd.
|
0010897682 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 68 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897562 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897660 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 66 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897142 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 14 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897500 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 50 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 1719730712 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount,0.38關m Selective Gold (Au) Plating, 12 Circuits, Tape and Reel |
| 1719730715 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount,0.38關m Selective Gold (Au) Plating, 15 Circuits, Tape and Reel |
| 1719730719 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount,0.38關m Selective Gold (Au) Plating, 19 Circuits, Tape and Reel |
| 1719730721 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount,0.38關m Selective Gold (Au) Plating, 21 Circuits, Tape and Reel |
| 1719730803 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount,0.75關m Selective Gold (Au) Plating, 3 Circuits, Tape and Reel |
| 1719750006 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 6 Circuits |
| 1719750011 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 11 Circuits |
| 1719750014 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 14 Circuits |
| 1719750016 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 16 Circuits |
| 1719750019 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 19 Circuits |
| 1719750021 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 21 Circuits |
| 1719750022 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 22 Circuits |
| 1719750025 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 25 Circuits |
| 1719750104 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 4 Circuits |
| 1719750124 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 24 Circuits |
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