| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd.
|
0873812463 |
327Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, with Cap, without Locating Pegs, 24 Circuits, Lead-free |
| 0872631423 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關) Gold (Au) Selective, 14 Circuits, without Pick-and-Place Cap, Tube, Leadfree |
| 0877590465 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tube Packaging |
| 0757575401 |
177Kb/4P |
3.50mm (.138) Pitch, MX150??Header, Breakaway, Vertical, 20 Circuits, 1.5關m (60關) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length |
| 0850037005 |
80Kb/3P |
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.30關m (12關) Selective Gold (Au) Plating, 96 Circuits, without Mounting Clips |
| 0872630403 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關) Gold (Au) Selective, 4 Circuits, with Pick-and-Place Cap, Tube, Leadfree |
| 0754332255 |
253Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX짰 Backplane Connector System, Left Guide Header Position E, 150 Circuits, Gold (Au) 0.76關m (30關) |
| 0780350301 |
491Kb/7P |
0.60mm (.024) Pitch miniDIMM DDR3 Socket, Surface Mount, 22.5째 Reverse Angle, 0.76關m (30關) Gold (Au) Plating, Off-White Latches, 244 Circuits,1.5V Voltage Key |
| 0872633025 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.76關m (30關) Gold (Au) Selective, 30 Circuits, without Pick-and-Place Cap, Tube, Leadfree |
| 0873811264 |
327Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, with Cap, without Locating Pegs, 12 Circuits, Lead-free |
| 0873815074 |
325Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, without Cap, without Locating Pegs, 50 Circuits, Lead-free |
| 0872631405 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.76關m (30關) Gold (Au) Selective, 14 Circuits, with Pick-and-Place Cap, Tube, Leadfree |
| 0850039036 |
193Kb/4P |
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.80關m (32關) Selective Gold (Au) Plating, 96 Circuits, with Mounting Clips |
| 0850039001 |
79Kb/3P |
2.54mm (.100) Pitch DIN 41612 C Style Male Header, Right Angle, Through Hole, 0.60關m (24關) Selective Gold (Au) Plating, 64 Circuits, without Mounting Clips |
| 0753427777 |
316Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair, GbX짰 Backplane Connector System, Power Module, 2-Up Assembly, 16 Circuits, 1.27關m (50關) Gold (Au) |
| 0873813264 |
327Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關) Gold (Au) Plating, with Cap, without Locating Pegs, 32 Circuits, Lead-free |
| 0758612204 |
170Kb/3P |
1.85mm by 1.85mm (.073" by .073") Pitch 2-Pair GbX짰 Backplane L-Series Connector System, Left Guide Header, 125 Circuits, Gold (Au) 0.76關m (30關") |
| 0872634225 |
367Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.76關m(30關") Gold (Au) Selective, 42 Circuits, without Pick-and-Place Cap, Tube, Leadfree |
| 0877156202 |
348Kb/6P |
1.00mm (.039") Pitch, PCI Express* Connector, 98 Circuits, Nylon 6/6 Glass-filledBlack Housing, Phosphor Bronze, 0.38關m (15關") Gold (Au) Plating, with Plastic Pegs, |
| 0791098416 |
1Mb/12P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Vertical, Top/BottomEntry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel, 0.38關m (15關") |
German ▼ 
English
Chinese
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
