| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd.
|
0873812000 |
325Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.76關m (30關) Gold (Au) Plating, without Cap, without Locating Peg, 20 Circuits, Tape and Reel |
| 0873401424 |
276Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, with Locating Pegs, 0.38關m (15關) Gold (Au) Plating, 14 Circuits, Lead-free |
| 0758270504 |
184Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane Connector System, Open Header, 20 Circuits, Gold (Au) 0.76關m (30關), Pin Length 4.55mm (.179) |
| 0877156215 |
347Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 98 Circuits, Nylon 6/6 Glass-filled, White Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating, with Plastic Pegs |
| 0877159309 |
628Kb/10P |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76關m (30關) Gold (Au) Plating, with Plastic Pegs |
| 0752370103 |
286Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 5-Pair GbX짰 Backplane Connector System, Open Header, 100 Circuits, Gold (Au) 0.76關m (30關), Pin Length 3.55mm (.140) |
| 0877159206 |
337Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 98 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.76關m (30關) Gold (Au) Plating, with Plastic Pegs |
| 0877156002 |
340Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 6/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating, with Plastic Pegs |
| 0876935311 |
402Kb/7P |
1.27mm (.050) Pitch DDR DIMM Socket, Vertical, Press-fit, 2.5V Voltage Keys (Left), 3.32mm (.131) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating, Clear Latches |
| 0875378812 |
214Kb/4P |
1.27mm (.050) Pitch EBBI??50D Receptacle, Through Hole, Right Angle, Blind Mate, with Beveled Metal Pin and Plastic Peg, 0.76關m (30關) Gold (Au) Selective Plating |
| 0877159105 |
337Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 64 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating, with Plastic Pegs |
| 0850037055 |
70Kb/3P |
2.54mm (.100) Pitch DIN 41612 C/2 Style Male Header, Right Angle, Through Hole, 1.27關m (50關) Selective Gold (Au) Plating, 48 Circuits, without Mounting Clips |
| 0873401014 |
276Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, without Locating Peg, 0.38關m (15關) Gold (Au) Plating, 10 Circuits, Lead-free |
| 0752350703 |
262Kb/3P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Open Header, 56 Circuits, Gold (Au) 0.76關m (30關), Pin Length 3.55mm (.140) |
| 0780350202 |
488Kb/7P |
0.60mm (.024") Pitch miniDIMM DDR Socket, Surface Mount, 22.5째 Reverse Angle, 0.76關m (30關") Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 200 Circuits |
| 0850031794 |
84Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Style C/2, Right Angle, Through Hole, 0.6關m (24關") Selective Gold (Au), 48 Circuits, Board Lock Option Available, Lead free |
| 0873400823 |
276Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, with Locating Pegs, 0.76關m (30關") Gold (Au) Plating, 8 Circuits, Lead-free, Tube |
| 0872632493 |
367Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m(15關") Gold (Au) Selective, 24 Circuits, with Pick-and-Place Cap, Embossed Tape onReel, Leadfree |
| 0758610105 |
166Kb/3P |
1.85mm by 1.85mm (.073" by .073") Pitch 2-Pair GbX짰 Backplane L-Series ConnectorSystem, Open Header, 55 Circuits, Gold (Au) 0.76關m (30關"), Pin Length 5.55mm.219") |
| 0873401298 |
186Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount (Very Low Profile), Top Entry, with Locating Pegs, with Pick-and-Place Cap, 0.76關m (30關) Gold (Au) Plating |
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