General Description
This MOSFET is designed to replace a single MOSFET and parallel Schottky diode in synchronous DC:DC power supplies. Combining Fairchild’s 30V PowerTrench SyncFET process with state of the art BGA packaging, the FDZ7064AS minimizes both PCB space and RDS(ON). This BGA SyncFET embodies a breakthrough in both packaging and power MOSFET integration which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, ultra-low reverse recovery charge and low RDS(ON).
   
Features
■ 13.5 A, 30 V. RDS(ON) = 5.6 mΩ @ VGS = 10 V
                         RDS(ON) = 7.1 mΩ @ VGS = 4.5 V
■ Occupies only 14 mm2 of PCB area. Only 42% of the area of
    SO-8
■ Ultra-thin package: less than 0.76 mm height when mounted
    to PCB
■ 3.5 x 4 mm2 Footprint
■ High power and current handling capability.

Applications
■ DC/DC converters