Features
For surface mounted applications in order to optimize board space
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
1500W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycle): 0.01%
Fast response time
Typical IR less than 1μA above 10V
High Temperature soldering: 260℃/10 seconds at terminals
Plastic package has underwriters laboratory flammability 94V-0
Meets MSL level 1, per J-STD-020
Safety certification: UL: E244458
IEC61000-4-2 ESD 30KV Air, 30KV contact compliance