Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Maxim Integrated Produc... |
21-0109B
|
35Kb / 1P |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
Rev B |
21-0664
|
46Kb / 2P |
PACKAGE OUTLINE 12L TDFN, 3*3*0.75MM
REV .B |
21-0108
|
71Kb / 2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
Rev K |
21-0111
|
31Kb / 1P |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD
Rev E |
21-0451
|
41Kb / 2P |
PACKAGE OUTLINE, 12L ULTRA TDFN, NIPD, 3*3*0.50MM
REV .C |
21-0429
|
71Kb / 2P |
PACKAGE OUTLINE, 10L TDFN, 3*2*0.75MM
REV .C |
90-0397
|
27Kb / 1P |
PACKAGE LAND PATTERN, 12L TDFN, 3*3
Rev C |
21-0041
|
39Kb / 1P |
PACKAGE OUTLINE, 8L, 14L, 16L SOIC, 150INCH
Rev B |
Protek Devices |
DFN-2-0402
|
280Kb / 5P |
package outline & pad layout
|
Zetex Semiconductors |
MLP322
|
176Kb / 3P |
Surface mounted, 3 pin package Package outline
|