Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Maxim Integrated Produc... |
21-0612
|
37Kb / 1P |
PACKAGE OUTLINE, 4 BUMPS THIN WLP PKG. 0.4MM PITCH
REV .A |
90-0037
|
28Kb / 1P |
PACKAGE LAND PATTERN, 20L TQFN, 4*4MM
Rev E |
21-0136F
|
55Kb / 2P |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm
Rev F |
Dallas Semiconductor |
21-0102
|
109Kb / 2P |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
Maxim Integrated Produc... |
21-0104
|
40Kb / 1P |
PACKAGE OUTLINE, 12BUMPS, 3*4ARRAY, UCSP(B)PKG.
Rev G |
21-0139
|
74Kb / 2P |
PACKAGE OUTLINE, 12,16,20,24,28L TQFN, 4*4*0.75MM
REV .L |
21-0542
|
52Kb / 1P |
PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH
REV .C |
21-0491
|
52Kb / 1P |
PACKAGE OUTLINE 16 BUMPS WLP PKG. 0.4MM PITCH
REV .G |
21-0548
|
47Kb / 1P |
PACKAGE OUTLINE 30 BUMPS, WLP PKG. 0.4MM PITCH
REV .D |
Continental Device Indi... |
WOM
|
57Kb / 3P |
WOM 4-Leads Leaded Plastic Package
|