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LSM6DSOP Datenblatt(PDF) 102 Page - STMicroelectronics |
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LSM6DSOP Datenblatt(HTML) 102 Page - STMicroelectronics |
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102 / 107 page ![]() Soldering information LSM6DSOP 102/107 DocID032926 Rev 5 15 Soldering information The LGA package is compliant with the ECOPACK, RoHS and "Green" standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com/mems. |
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