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STM32MP151F Datenblatt(PDF) 248 Page - STMicroelectronics |
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STM32MP151F Datenblatt(HTML) 248 Page - STMicroelectronics |
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248 / 253 page ![]() Package information STM32MP151C/F 248/253 DS12501 Rev 3 7.5.1 Reference documents JESD51-6 Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air). Available from www.jedec.org. JESD51-8 Integrated Circuit Thermal Test Method Environmental Conditions —Junction-to- Board. Available from www.jedec.org. JESD51-9 Test Boards for Area Array Surface. Mount Package Thermal. Measurements. Available from www.jedec.org. JESD51-12 Guidelines for Reporting and Using Electronic Package Thermal Information. Available from www.jedec.org. |
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