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STM32G47PBY3XXX Datenblatt(PDF) 221 Page - STMicroelectronics |
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STM32G47PBY3XXX Datenblatt(HTML) 221 Page - STMicroelectronics |
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221 / 229 page ![]() DS12712 Rev 3 221/229 STM32G473xB STM32G473xC STM32G473xE Package information 225 Figure 77. UFBGA121 - recommended footprint Table 117. UFBGA121 - recommended PCB design rules Dimension Recommended values Pitch 0.5 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm BGA WLCSP FT V1 Dsm Dpad |
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