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STM32G474PBY3XXX Datenblatt(PDF) 228 Page - STMicroelectronics |
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STM32G474PBY3XXX Datenblatt(HTML) 228 Page - STMicroelectronics |
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228 / 236 page ![]() Package information STM32G474xB STM32G474xC STM32G474xE 228/236 DS12288 Rev 5 Figure 78. UFBGA121 - recommended footprint Table 122. UFBGA121 - recommended PCB design rules Dimension Recommended values Pitch 0.5 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm BGA WLCSP FT V1 Dsm Dpad |
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