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32G474 Datenblatt(PDF) 229 Page - STMicroelectronics |
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32G474 Datenblatt(HTML) 229 Page - STMicroelectronics |
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229 / 236 page ![]() DS12288 Rev 4 229/236 STM32G474xB STM32G474xC STM32G474xE Package information 233 Figure 77. UFBGA121 - recommended footprint Table 122. UFBGA121 - recommended PCB design rules Dimension Recommended values Pitch 0.5 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm BGA WLCSP FT V1 Dsm Dpad |
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