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STM32469VG Datenblatt(PDF) 198 Page - STMicroelectronics |
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STM32469VG Datenblatt(HTML) 198 Page - STMicroelectronics |
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198 / 220 page ![]() Package information STM32F469xx 198/220 DS11189 Rev 7 samples to run qualification activity. 6.3 WLCSP168 package information This WLCSP is a 168-pin, 4.891 x 5.692 mm, 0.4 mm pitch wafer level chip scale package. Figure 86. WLCSP168 - Outline A02S_ME_V2 e1 F G e e Bottom view Bump side e2 A1 ball location D A1 orientation reference Top view Wafer back side Detail A A3 A2 Side view A E Detail A Rotated 90° eee Bump Seating plane b A1 A3 ccc ddd Z Z X Y Z aaa (4X) Z bbb Z X Y |
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