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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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ST25DV64KC Datenblatt(PDF) 156 Page - STMicroelectronics |
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ST25DV64KC Datenblatt(HTML) 156 Page - STMicroelectronics |
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156 / 203 page  10.3 UFDFN8 package information UFDFPN8 is an 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package. Figure 88. UFDFN8 - Outline Top view Pin #1 ID marking Side view Seating plane eee ccc C C C C C B A 1 2 N D E aaa aaa A A1 A3 2x 2x Datum A Terminal tip Detail “A” Even terminal L1 L3 L e e/2 Pin #1 ID marking Bottom view See Detail “A” e e 1 2 ND-1 x D2 L1 L3 E2 K L b 1. Max. package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. ST25DV04KC ST25DV16KC ST25DV64KC UFDFN8 package information DS13519 - Rev 3 page 156/203 |
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