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STM32H757AI Datenblatt(PDF) 194 Page - STMicroelectronics

Teilenummer STM32H757AI
Bauteilbeschribung  Dual 32-bit Arm® Cortex®-M7 up to 480MHz and -M4 MCUs, 2MB Flash, 1MB RAM, 46 com. and analog interfaces, SMPS, DSI, crypto
PDF  251 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
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STM32H757AI Datenblatt(HTML) 194 Page - STMicroelectronics

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Electrical characteristics
STM32H757xI
194/251
DS12931 Rev 1
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 46 or Figure 47,
depending on whether VREF+ is connected to VDDA or not. The 100 nF capacitors should be
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 46. Power supply and reference decoupling (VREF+ not connected to VDDA)
1. VREF+ input is available on all package whereas the VREF– s available only on UFBGA176+25 and
TFBGA240+25. When VREF- is not available, it is internally connected to VDDA and VSSA.
Figure 47. Power supply and reference decoupling (VREF+ connected to VDDA)
1. VREF+ input is available on all package whereas the VREF– s available only on UFBGA176+25 and
TFBGA240+25. When VREF- is not available, it is internally connected to VDDA and VSSA.
MSv50648V1
1 μF // 100 nF
1 μF // 100 nF
STM32
VREF+
(1)
VSSA/VREF+
(1)
VDDA
MSv50649V1
1 μF // 100 nF
STM32
VREF+/VDDA
(1)
VREF-/VSSA
(1)



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