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STM32H757AI Datenblatt(PDF) 232 Page - STMicroelectronics

Teilenummer STM32H757AI
Bauteilbeschribung  Dual 32-bit Arm® Cortex®-M7 up to 480MHz and -M4 MCUs, 2MB Flash, 1MB RAM, 46 com. and analog interfaces, SMPS, DSI, crypto
PDF  251 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H757AI Datenblatt(HTML) 232 Page - STMicroelectronics

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Package information
STM32H757xI
232/251
DS12931 Rev 1
Figure 73. WLCSP156 bump recommended footprint
1. Dimensions are expressed in millimeters.
Table 132. WLCSP156 package mechanical data
Symbol
millimeters
inches(1)
1. Values in inches are converted from mm and rounded to the 3rd decimal digits.
Min
Typ
Max
Min
Typ
Max
A-
-
0.58
-
-
0.023
A1
-
0.17
-
-
0.006
-
A2
-
0.38
-
-
0.015
-
A3
-
0.025(2)
2. Back side coating. Nominal dimension rounded to the 3rd decimal place resulting from process capability.
--
0.001
-
b
0.21
0.24
0.27
0.008
0.009
0.011
D
4.94
4.96
4.98
0.193
0.195
0.196
E
4.62
4.64
4.66
0.181
0.182
0.183
e1
-
4.20
-
-
0.014
-
e2
-
3.85
-
-
0.165
-
e
-
0.35
-
-
0.152
-
F
-
0.380(3)
3. Calculated dimensions are rounded to 3rd decimal place.
--
0.015
-
G
-
0.395(3)
--
0.015
-
aaa
-
-
0.10
-
-
0.004
bbb
-
-
0.10
-
-
0.004
ccc
-
-
0.10
-
-
0.004
ddd
-
-
0.05
-
-
0.002
eee
-
-
0.05
-
-
0.002
A086_WLCSP156_FP_V1
Dpad
Dsm



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