TDA4VE...ALZQ1 datasheet(249/251 Pages) TI

Teilenummer	TDA4VE...ALZQ1

Bauteilbeschribung	TDA4VE TDA4AL TDA4VL Jacinto™ Processors, Silicon Revision 1.0

PDF	251 Pages

Scroll/Zoom	100%

Hersteller	TI [Texas Instruments]

Direct Link	http://www.ti.com

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249 / 251 page

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

EXAMPLE BOARD LAYOUT

4226636/A 03/2021

www.ti.com

FCBGA - 2.57 mm max height

ALZ0770A

BALL GRID ARRAY

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 0.225X

(0.8) TYP

770X (Ø 0.4)

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

SOLDER MASK DETAILS

NOT TO SCALE

Ø 0.4

(METAL)

SOLDER MASK

OPENING

0.07 MAX

EXPOSED METAL

NON-SOLDER MASK

DEFINED

(PREFERRED)

(Ø 0.4)

SOLDER MASK

OPENING

0.07 MAX

METAL UNDER

SOLDERMASK

SOLDER MASK

DEFINED

EXPOSED METAL

TDA4VE...ALZQ1 Datenblatt(PDF) 249 Page - Texas Instruments