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Datenblatt-Suchmaschine für elektronische Bauteile |
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550MW7C Datenblatt(PDF) 8 Page - HB Electronic Components |
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550MW7C Datenblatt(HTML) 8 Page - HB Electronic Components |
8 / 10 page ![]() 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. FORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) Page : 7 Stand-off Fig.5 Fig.6 Tube F i g . 7 LED LAMP APPLICATION |
Ähnliche Teilenummer - 550MW7C |
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Ähnliche Beschreibung - 550MW7C |
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