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Datenblatt-Suchmaschine für elektronische Bauteile |
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BT-301-50M Datenblatt(PDF) 7 Page - List of Unclassifed Manufacturers |
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BT-301-50M Datenblatt(HTML) 7 Page - List of Unclassifed Manufacturers |
7 / 18 page ![]() General & Thermal High Performance Epoxy www.wakefield-vette.com Thermal Conductivity, W/m- °K Dielectric Strength, V/mil 1.04 440 5.3 2.4 x 1012 Dielectric Constant, 25 °C, 100Hz Volume Resistivity, ohm-cm, 25 °C Coefficient of Thermal Expansion, ppm/ °C Below Tg Above Tg 45 175 -40 to +120 Operating Temperature, °C NOTES: 1) At room temperature, BT-301-XXM will reach handle cure within 1-2 hours. The lap shear strength is 1,413 psi after 4 hours. 2) This product is an adhesive and is not designed for potting and encapsulating applications. BT-301-XXM is a fast reacting epoxy system and it will create a high exothermic temperature in large mass sizes (avoid mass sizes greater than 25 grams). INSTRUCTIONS FOR USE: 1) Surfaces must be clean and grease free. Use an oil free solvent such as acetone to wipe surfaces. Adhesion can be substantially increased by abrading the surfaces to be bonded with emery cloth, sand paper, carbide grinding tools, sand blasting, etc... A roughened, porous surface will produce the best results. Any oxidized metal films should be removed just prior to application of the epoxy adhesive mixture. Dispense material from BondaTherm Equalizer. Apply mixed product to substrate to be bonded. Join substrates within 3-5 minutes. Cure according to one of the following schedules: 2) 3) 4) 5) 25 °C 2-4 hours 65 °C < 10 minutes STORAGE, HANDLING AND AVAILABILITY: Store in a cool, dry place in original containers. Please read and understand the Safety Data Sheet (SDS) before using this product. BT-301-50M BT-301-200M (cont.) Bondatherm Cartridges |
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Ähnliche Beschreibung - BT-301-50M |
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