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BT-301-50M Datenblatt(PDF) 7 Page - List of Unclassifed Manufacturers

Teilenummer BT-301-50M
Bauteilbeschribung  General & Thermal High Performance Epoxy
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General & Thermal High Performance Epoxy
www.wakefield-vette.com
Thermal Conductivity, W/m-
°K
Dielectric Strength, V/mil
1.04
440
5.3
2.4 x 1012
Dielectric Constant, 25
°C, 100Hz
Volume Resistivity, ohm-cm, 25
°C
Coefficient of Thermal Expansion, ppm/
°C
Below Tg
Above Tg
45
175
-40 to +120
Operating Temperature,
°C
NOTES:
1) At room temperature, BT-301-XXM will reach handle cure within 1-2 hours. The lap
shear strength is 1,413 psi after 4 hours.
2) This product is an adhesive and is not designed for potting and encapsulating
applications. BT-301-XXM is a fast reacting epoxy system and it will create a
high exothermic temperature in large mass sizes (avoid mass sizes greater
than 25 grams).
INSTRUCTIONS FOR USE:
1) Surfaces must be clean and grease free. Use an oil free solvent such as acetone to
wipe surfaces. Adhesion can be substantially increased by abrading the surfaces to
be bonded with emery cloth, sand paper, carbide grinding tools, sand blasting, etc...
A roughened, porous surface will produce the best results. Any oxidized metal films
should be removed just prior to application of the epoxy adhesive mixture.
Dispense material from BondaTherm Equalizer.
Apply mixed product to substrate to be bonded.
Join substrates within 3-5 minutes.
Cure according to one of the following schedules:
2)
3)
4)
5)
25
°C 2-4 hours
65
°C < 10 minutes
STORAGE, HANDLING AND AVAILABILITY:
Store in a cool, dry place in original containers.
Please read and understand the Safety Data Sheet (SDS) before using this product.
BT-301-50M BT-301-200M (cont.)
Bondatherm Cartridges


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