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STM32H7B3AI Datenblatt(PDF) 195 Page - STMicroelectronics |
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STM32H7B3AI Datenblatt(HTML) 195 Page - STMicroelectronics |
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195 / 238 page ![]() Table 131. TFBGA100 - Recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.400 mm Dsm 0.470 mm typical (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm STM32H7B3xI TFBGA100 package information DS13139 - Rev 8 page 195/238 |
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