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PIC16F1507-E/SS. Datenblatt(PDF) 272 Page - Microchip Technology |
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PIC16F1507-E/SS. Datenblatt(HTML) 272 Page - Microchip Technology |
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272 / 278 page ![]() PIC16(L)F1507 DS40001586D-page 272 2011-2015 Microchip Technology Inc. Microchip Technology Drawing C04-255A Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Number of Terminals Overall Height Terminal Width Overall Width Overall Length Terminal Length Exposed Pad Width Exposed Pad Length Terminal Thickness Pitch Standoff Units Dimension Limits A1 A b D E2 D2 A3 e L E N 0.50 BSC 0.127 REF 2.60 2.60 0.30 0.20 0.45 0.00 0.25 4.00 BSC 0.40 2.70 2.70 0.50 0.02 4.00 BSC MILLIMETERS MIN NOM 20 2.80 2.80 0.50 0.30 0.55 0.05 MAX K- 0.20 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. 2. 3. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad 20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN] |
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