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STM32F427AI Datenblatt(PDF) 223 Page - STMicroelectronics |
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STM32F427AI Datenblatt(HTML) 223 Page - STMicroelectronics |
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223 / 240 page ![]() DS9405 Rev 12 223/240 STM32F427xx STM32F429xx Package information 231 Figure 94. TFBGA216 - Footprint example Table 122. TFBGA216 - Example of PCB design rules (0.8 mm pitch) Dimension Values Pitch 0.8 mm Dpad 0.400 mm Dsm 0.470 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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