AM1808AZCED3 datasheet(259/264 Pages) TI

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AM1808

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SPRS653A – FEBRUARY 2010 – REVISED APRIL 2010

8.2

Thermal Data for ZCE Package

The following table(s) show the thermal resistance characteristics for the PBGA–ZCE mechanical

package.

Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

7.6

N/A

ΘJB

Junction-to-board

11.3

N /A

ΘJA

Junction-to-free air

23.9

0.00

21.2

0.50

20.3

1.00

ΘJMA

Junction-to-moving air

19.5

2.00

18.6

4.00

0.2

0.00

0.3

0.50

PsiJT

Junction-to-package top

0.3

1.00

0.4

2.00

0.5

4.00

11.2

0.00

11.1

0.50

PsiJB

Junction-to-board

11.1

1.00

11.0

2.00

10.9

4.00

(1)

These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.

For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment

Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount

Packages. Power dissipation of 500 mW and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness

and 1.5oz (50um) inner copper thickness

(2)

m/s = meters per second

Mechanical Packaging and Orderable Information

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