MPC8544E datasheet(102/117 Pages) FREESCALE

Teilenummer	MPC8544E

Bauteilbeschribung	MPC8544E PowerQUICC III Integrated Processor Hardware Specifications

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Hersteller	FREESCALE [Freescale Semiconductor, Inc]

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MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5

102

Freescale Semiconductor

Thermal

Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see

Figure 61). Therefore, the synthetic grease offers the best thermal performance, especially at the low

interface pressure.

Figure 63. Thermal Performance of Select Thermal Interface Materials

The system board designer can choose between several types of thermal interface. There are several

commercially-available thermal interfaces provided by the following vendors:

Chomerics, Inc. 781-935-4850

77 Dragon Ct.

Woburn, MA 01801

Internet: www.chomerics.com

Dow-Corning Corporation800-248-2481

Corporate Center

P.O.Box 999

Midland, MI 48686-0997

Internet: www.dow.com

Shin-Etsu MicroSi, Inc.888-642-7674

10028 S. 51st St.

Phoenix, AZ 85044

Internet: www.microsi.com

The Bergquist Company800-347-4572

18930 West 78th St.

0.5

1.5

1020

4050

607080

Silicone Sheet (0.006 in.)

Bare Joint

Floroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

MPC8544E Datenblatt(PDF) 102 Page - Freescale Semiconductor, Inc