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NCV8772 Datenblatt(PDF) 3 Page - ON Semiconductor

Teilenummer NCV8772
Bauteilbeschribung  Ultra Low Iq 350 mA LDO Regulator with Enable and
PDF  17 Pages
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Hersteller  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
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NCV8772 Datenblatt(HTML) 3 Page - ON Semiconductor

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NCV8772
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ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage (Note 1)
DC
Transient, t < 100 ms
Vin
−0.3
40
45
V
Input Current
Iin
−5
mA
Output Voltage (Note 2)
Vout
−0.3
5.5
V
Output Current
Iout
−3
Current Limited
mA
Enable Input Voltage
DC
Transient, t < 100 ms
VEN
−0.3
40
45
V
Enable Input Current
IEN
−1
1
mA
DT (Reset Delay Time Select) Voltage
VDT
−0.3
5.5
V
DT (Reset Delay Time Select) Current
IDT
−1
1
mA
Reset Output Voltage
VRO
−0.3
5.5
V
Reset Output Current
IRO
−3
3
mA
Junction Temperature
TJ
−40
150
°C
Storage Temperature
TSTG
−55
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. 5.5 V or (Vin + 0.3 V) (whichever is lower).
ESD CAPABILITY (Note 3)
Rating
Symbol
Min
Max
Unit
ESD Capability, Human Body Model
ESDHBM
−2
2
kV
ESD Capability, Machine Model
ESDMM
−200
200
V
ESD Capability, Charged Device Model
ESDCDM
−1
1
kV
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charge Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Rating
Symbol
Min
Max
Unit
Moisture Sensitivity Level
DPAK−5
D2PAK−5
D2PAK−7
MSL
1
1
3
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions
TSLD
265 peak
°C
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
THERMAL CHARACTERISTICS (Note 5)
Rating
Symbol
Value
Unit
Thermal Characteristics, DPAK−5
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
RqJA
RYJC
56
8.4
°C/W
Thermal Characteristics, D2PAK−5
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
RqJA
RYJC
53
8.4
°C/W
Thermal Characteristics, D2PAK−7
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Case (Note 6)
RqJA
RYJC
51
8.4
°C/W
5. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.


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