GRM552B11H102KA01D datasheet(121/221 Pages) MURATA

121 / 221 page

119

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Chip Monolithic Ceramic Capacitors

for Bonding GMD Series

s Features

1. Small chip size (LxWxT: 0.6x0.3x0.3, 1.0x0.5x0.5mm)

2. Available for Wire/Die bonding due to

Gold termination.

3. Suitable for Optical device for telecommunication,

built-in IC packaging.

s Applications

1. Optical device for telecommunication

2. IC, built-in IC packaging

Part Number

0.6

±0.03

1.0

±0.05

0.3

±0.03

0.5

±0.05

0.3

±0.03

0.5

±0.05

0.12 to 0.22

0.15 to 0.35

0.16

0.3

GMD033

GMD155

g min.

Outer electrode: Au

Dimensions (mm)

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

10.12.20

GRM552B11H102KA01D Datenblatt(PDF) 121 Page - Murata Manufacturing Co., Ltd.

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