GRM552B11H102KA01D datasheet(190/221 Pages) MURATA

190 / 221 page

AC250V(r.m.s.) Type (Which Meet Japanese Law) Specifications and Test Methods

Continued from the preceding page.

Continued on the following page.

* "Room condition" Temperature: 15 to 35

D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa

Fix the capacitor to the supporting jig (glass epoxy board) shown

in Fig. 4.

Perform the 5 cycles according to the 4 heat treatments listed in

the following table.

Let sit for 24

T2 hrs. at room condition,* then measure.

#Pretreatment

Perform a heat treatment at 150

W 0

Y10

D for 60T5 min. and then

let sit for 24

T2 hrs. at room condition.*

Fig. 4

Temperature

Cycle

Appearance

No marking defects

Capacitance

Change

Within

T15%

D.F.

0.05 max.

I.R.

More than 2,000M

Ω

Dielectric

Strength

In accordance with item No.4

Preheat the capacitor as in table.

Immerse the capacitor in solder solution at 260

T5D for 10T1

sec. Let sit at room condition* for 24

T2 hrs., then measure.

#Immersing speed: 25T2.5mm/s

#Pretreatment

Perform a heat treatment at 150

W 0

Y10

D for 60T5 min. and then

let sit for 24

T2 hrs. at room condition.*

*Preheating

Resistance

to Soldering

Heat

Appearance

No marking defects

Capacitance

Change

Within

T10%

D.F.

0.025 max.

I.R.

More than 2,000M

Ω

Dielectric

Strength

In accordance with item No.4

The capacitor should be subjected to 40

T2D, relative humidity of

90 to 98% for 8 hrs., and then removed in room condition* for 16

hrs. until 5 cycles.

Humidity

Insulation

Appearance

No marking defects

Capacitance

Change

Within

T15%

D.F.

0.05 max.

I.R.

More than 1,000M

Ω

Dielectric

Strength

In accordance with item No.4

Immerse the capacitor in a solution of ethanol (JIS-K-8101) and

rosin (JIS-K-5902) (25% rosin in weight proportion).

Immerse in solder solution for 2

T0.5 sec.

Immersing speed: 25

T2.5mm/s

Temp. of solder: 245

T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)

235

T5°C H60A or H63A Eutectic Solder

Solderability of

Termination

75% of the terminations are to be soldered evenly and continuously.

Solder the capacitor to the testing jig (glass epoxy board) shown

in Fig. 2.

Then apply a force in the direction shown in Fig. 3. The soldering

should be done using the reflow method and should be

conducted with care so that the soldering is uniform and free of

defects such as heat shock.

Fig. 3

Deflection

No marking defects

Fig. 2

No.

Test Method

Specifications

Item

(mm)

Dimension (mm)

3.5

4.5

7.0

8.0

2.4

3.7

5.6

1.0

4.5

Z2.0

4.5

Z3.2

5.7

Z5.0

Step

Temperature

100 to 120

170 to 200

Time

1 min.

Step

Temperature (

Min. Operating Temp.

Room Temp.

Max. Operating Temp.

Room Temp.

Time (min.)

2 to 3

Solder resist

Glass Epoxy Board

100

φ4.5

t : 1.6

Capacitance meter

Flexure=1

(in mm)

20 50

R230

Pressurizing

speed: 1.0mm/s

Pressurize

GA2 Series Specifications and Test Methods

189

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C02E.pdf

10.12.20

GRM552B11H102KA01D Datenblatt(PDF) 190 Page - Murata Manufacturing Co., Ltd.

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