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CF745 Datenblatt(PDF) 199 Page - Microchip Technology

Teilenummer CF745
Bauteilbeschribung  EPROM/ROM-Based 8-Bit CMOS Microcontroller Series
PDF  217 Pages
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Hersteller  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

CF745 Datenblatt(HTML) 199 Page - Microchip Technology

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© 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 199
PIC16C5X
Package Type:
K04-052 28-Lead Plastic Small Outline (SO) – Wide, 300 mil
MIN
p
Pitch
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Radius Centerline
Gull Wing Radius
Shoulder Radius
Chamfer Distance
Outside Dimension
Molded Package Width
Molded Package Length
Shoulder Height
Overall Pack. Height
Lead Thickness
Foot Angle
Foot Length
Standoff
Number of Pins
β
α
B†
c
φ
X
A2
A1
A
n
E1
L
L1
R1
R2
E‡
D‡
Dimension Limits
Units
1.27
0.050
8
12
12
0.017
0
0.014
0
0.019
15
15
0.011
0.015
0.016
0.005
0.005
0.020
0.407
0.296
0.706
0.008
0.058
0.099
28
0.394
0.011
0.009
0.010
0
0.005
0.005
0.010
0.292
0.700
0.004
0.048
0.093
0.419
0.012
0.020
0.021
0.010
0.010
0.029
48
0.299
0.712
0.011
0.068
0.104
0.36
0
0
12
12
0.42
15
15
0.48
10.33
17.93
10.01
0.23
0.25
0.28
0.13
0.13
0.25
0
7.42
0.10
1.22
2.36
17.78
10.64
0.41
4
0.27
0.38
0.13
0.13
0.50
0.53
0.30
0.51
0.25
0.25
0.74
7.51
0.19
28
2.50
1.47
18.08
7.59
0.28
2.64
1.73
NOM
INCHES*
MAX
NOM
MILLIMETERS
MIN
MAX
n
1
2
R1
R2
D
p
B
E1
E
L1
L
c
β
45
°
X
φ
A1
α
A
A2
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”



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