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STM32F746VG Datenblatt(PDF) 221 Page - STMicroelectronics |
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STM32F746VG Datenblatt(HTML) 221 Page - STMicroelectronics |
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221 / 227 page ![]() DocID027590 Rev 4 221/227 STM32F745xx STM32F746xx Package information 226 Marking of engineering samples The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 102. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. |
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