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STM32F756VG Datenblatt(PDF) 203 Page - STMicroelectronics |
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STM32F756VG Datenblatt(HTML) 203 Page - STMicroelectronics |
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203 / 228 page ![]() DocID027589 Rev 4 203/228 STM32F756xx Package information 227 6.3 WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package information Figure 85. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. Table 115. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - |
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