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OMAP3530ECUS Datenblatt(PDF) 129 Page - Texas Instruments

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Teilenummer OMAP3530ECUS
Bauteilbeschribung  OMAP3530 and OMAP3525 Applications Processors
PDF  265 Pages
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OMAP3530ECUS Datenblatt(HTML) 129 Page - Texas Instruments

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background image
SRAM_LDO1
cap_vdd_sram_mpu_
iva
SRAM_LDO2
cap_vdd_sram_core
BG
WKUP_LDO
vdds_wkup_bg
DPLL_MPU
DPLL_IVA
DPLL_CORE
vdds_dpll_dll
vdds_sram
DPLL5
DPLL4
vdds_dpll_per
Video DAC
vdda_dac
MMC IOs
vdds_mmc1
OMAP Device
VSS
vssa_dac
Cvdds_sram
Ccap_vdd_sram_mpu_iva
Ccap_vdd_sram_core
Cvdds_wkup_bg
Cvdds_dpll_dll
Cvdds_dpll_per
Cvdda_dac
Cvdds_mmc1
vdda_dac
vdds_mmc1
vdds_sram
vdds_wkup_bg
vdds_dpll_per
vdds_dpll_dll
Ccap_vdd_wkup
cap_vdd_wkup
MPU
Vdd_mpu_iva
Cvdd_mpu_iva
vdd_mpu_iva
Core
vdd_core
Cvdd_core
Vdd_core
030-004
vdds_mmc1a
vdds_mmc1a
Cvdds_mmc1a
Video DAC
DSS
cap_vdd_d
cap_vdd_d
Ccap_vdd_d
I/Os and Memory
vdds
vdds_mem
Cvdds_mem
Cvdds
OMAP3530, OMAP3525
www.ti.com
SPRS507H – FEBRUARY 2008 – REVISED OCTOBER 2013
illustrates an example of power supply decoupling.
A.
Signals "vdds" and "vdds_mem" are combined with "vdds" on the CBC package.
B.
Signals "vdds" and "vdds_mem" are separate on the CBB and CUS packages.
Figure 3-2. Power Supply Decoupling
Copyright © 2008–2013, Texas Instruments Incorporated
ELECTRICAL CHARACTERISTICS
129
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Product Folder Links: OMAP3530 OMAP3525



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