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STM32F401CB Datenblatt(PDF) 114 Page - STMicroelectronics |
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STM32F401CB Datenblatt(HTML) 114 Page - STMicroelectronics |
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114 / 135 page ![]() DocID024738 Rev 6 114/135 STM32F401xB STM32F401xC Package information 130 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 WLCSP49 2.965x2.965 mm package information Figure 46. WLCSP49 - 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. |
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