114- 1056

Rev D

3

of 7

C. Chemical Exposure

Do not store switches near any chemicals listed below, as they may cause stress corrosion cracking in the

components.

Alkalies

Ammonia

Citrates

Phosphates Citrates

Sulfur Compounds

Amines

Carbonates

Nitrites

Sulfur Nitrites

Tartrates

Where the above environmental conditions exist, phosphor--bronze contacts are recommended.

3.4. PC Board

A. Material and Thickness

The pc board material must be glass epoxy (FR--4 or G--10). The pc board thickness shall be 2.36 [.093].

Contact PRODUCT INFORMATION at the number at the bottom of page 1 for suitability of other pc board materials

and thicknesses.

B. Tolerance

Maximum allowable bow of the pc board must be 0.08 [.003] over each 25.4 [1.00] of length.

C. Layout

The solder tail contact holes in the pc board must be precisely located to ensure proper placement and

optimum performance of the switch. The layout dimensions and tolerances shown in Figure 2 must be

observed when preparing pc boards for the various switches. The layout shows the top (component) side

of the board.

Figure 2

2.54+0.13 [.100+.005] Typ

0.89+0.13 [.035+.005] Dia Typ

7.62+0.13

[.300+.005]

Recommended PC Board Layout

Note:

Not to Scale

3.5. Holes

The holes in the pc board for the contact solder tails must be drilled and plated through to specific dimensions

giveninFigure3.

3.6. Mounting Requirements

Determine whether the switch will be soldered directly to the pc board (a sealed switch will be required), or

whether the switch is to be installed in a socket (an unsealed switch can be used).

A. DIP Socket

1. Secure DIP socket to pc board according to instructions packaged with socket.

2. Start one row of contact leads into one row of contact cavities in socket, then rotate switch until it is

parallel with socket.

NOTE

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NOTE

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