STM32L053 datasheet(118/132 Pages) STMICROELECTRONICS

Teilenummer	STM32L053

Bauteilbeschribung	Reset and supply management

PDF	132 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

Logo

118 / 132 page

Package information

STM32L053x6 STM32L053x8

118/132

DocID025844 Rev 7

Figure 41. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball

,grid array recommended footprint

Note:

Non solder mask defined (NSMD) pads are recommended.

4 to 6 mils solder paste screen printing process.

0.500

0.0197

0.750

0.0295

ddd

0.080

0.0031

eee

0.150

0.0059

fff

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 83. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA)

Dimension

Recommended values

Pitch

0.5

Dpad

0.27 mm

Dsm

0.35 mm typ. (depends on the soldermask

registration tolerance)

Solder paste

0.27 mm aperture diameter.

Table 82. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball

grid array package mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

STM32L053 Datenblatt(PDF) 118 Page - STMicroelectronics

STM32L053 Datenblatt(HTML) 118 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datenblatt Download

Link URL