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STM32F769AI Datenblatt(PDF) 243 Page - STMicroelectronics |
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STM32F769AI Datenblatt(HTML) 243 Page - STMicroelectronics |
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243 / 255 page ![]() DocID029041 Rev 4 243/255 STM32F765xx STM32F767xx STM32F768Ax STM32F769xx Package information 254 Figure 96. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale package recommended footprint 1. Dimensions are expressed in millimeters. Table 130. WLCSP 180-bump, 5.5 x 6 mm, recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.1 mm |
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