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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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MPX2202DP Datenblatt(PDF) 303 Page - Motorola, Inc |
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MPX2202DP Datenblatt(HTML) 303 Page - Motorola, Inc |
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303 / 670 page  MPXH6300A SERIES 3–157 Motorola Sensor Device Data www.motorola.com/semiconductors SURFACE MOUNTING INFORMATION MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct pad geometry, the packages will self–align when subjected to a solder reflow process. It is always recommended to fabri- cate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. Figure 5. SSOP Footprint (Case 1317 and 1317A) 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 TYP Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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