10608-ND Datenblatt, PDF

Hersteller

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Molex Electronics Ltd.	0015910608-ND	1Mb/8P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
SICK AG	1060809	3Mb/9P	PHOTOELECTRIC SENSORS
SICK AG	1060810	3Mb/9P	PHOTOELECTRIC SENSORS
Weidmuller	1060810000	436Kb/4P	SL-SMT 3.50/03/90RF 1.5SN BK BX
SICK AG	1060812	3Mb/8P	PHOTOELECTRIC SENSORS
	1060814	2Mb/8P	PHOTOELECTRIC SENSORS
	1060815	2Mb/8P	PHOTOELECTRIC SENSORS
Weidmuller	1060820000	432Kb/4P	SL-SMT 3.50/16/90RF 1.5SN BK BX
SICK AG	1060821	912Kb/5P	2D LASER SCANNERS 2016-03-19
RUKO GmbH PrÃ¤zisionswe...	106083	317Kb/1P	HSS bi-metal hole saws, with varied toothing
Weidmuller	1060830000	515Kb/7P	SVF 7.62HP/02/180G SN BK BX
SICK AG	1060832	596Kb/5P	2D LASER SCANNERS
SICK AG	1060834	921Kb/6P	2D LASER SCANNERS 2016-03-19
TE Connectivity Ltd	1060840-1	127Kb/3P	Solder Assembly Kit
Weidmuller	1060840000	520Kb/7P	SVF 7.62HP/03/180G SN BK BX
Weidmuller	1060850000	464Kb/7P	SVF 7.62HP/04/180G SN BK BX
SICK AG	1060859	1Mb/7P	MEASURING AUTOMATION LIGHT GRIDS
RUKO GmbH PrÃ¤zisionswe...	106086	317Kb/1P	HSS bi-metal hole saws, with varied toothing
Molex Electronics Ltd.	106086-5213	476Kb/2P	MTP* Backplane Interconnect System (BMTP)
	106086-5220	476Kb/2P	MTP* Backplane Interconnect System (BMTP)
	106086-5221	476Kb/2P	MTP* Backplane Interconnect System (BMTP)

10608-ND Datasheet ,PDF