10667-ND Datenblatt, PDF

Hersteller

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Molex Electronics Ltd.	0015910667-ND	1Mb/8P	2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
SICK AG	1066785	254Kb/4P	LEVEL SENSORS
	1066786	254Kb/4P	LEVEL SENSORS
	1066787	254Kb/4P	LEVEL SENSORS
	1066788	254Kb/4P	LEVEL SENSORS
	1066789	591Kb/6P	LEVEL SENSORS
	1066790	254Kb/4P	LEVEL SENSORS
	1066791	254Kb/4P	LEVEL SENSORS
	1066792	254Kb/4P	LEVEL SENSORS
Schurter Inc.	1066-H-ABCN-D-EGO	371Kb/3P	IEC Appliance Inlet C18 with Fuseholder 1- or 2-pole
Heyco.	10660	67Kb/1P	Nylon PCB Supports - Screw and Lock
Molex Electronics Ltd.	106601-1050	1Mb/2P	VITA 66.1 Ruggedized Optical MT Backplane Interconnect System
Molex Electronics Ltd.	106601-1150	1Mb/2P	VITA 66.1 Ruggedized Optical MT Backplane Interconnect System
PHOENIX CONTACT	1066082	102Kb/5P	Connector - HC-M-08-EMC-DSUB-M 09/12/2020
Heyco.	10661	67Kb/1P	Nylon PCB Supports - Screw and Lock
SICK AG	1066165	1Mb/8P	PHOTOELECTRIC SENSORS
Heyco.	10662	67Kb/1P	Nylon PCB Supports - Screw and Lock
SICK AG	1066207	3Mb/8P	PHOTOELECTRIC SENSORS
SICK AG	1066208	3Mb/8P	PHOTOELECTRIC SENSORS
Belden Inc.	106624	519Kb/4P	AS-Interface Data Double-Ended Cordset 02-03-2025
PHOENIX CONTACT	1066259	180Kb/3P	VL 2000/3000 240 GB SSD KIT - Memory

10667-ND Datasheet ,PDF