| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd. |
70567-0001
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
70567-0001
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0007
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
|
|
70567-0007
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0008
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
|
|
70567-0008
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0009
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
|
|
70567-0009
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
|
|
70567-0010
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
|
|
70567-0010
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
|
|
70567-0011
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
|
|
70567-0011
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
|
|
70567-0012
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shouded, High Temperature, 28 Circuits, Tin (Sn) Plating
|
|
70567-0012
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
|
|
70567-0013
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
|
|
70567-0013
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, Tin (Sn) Plating
|
|
70567-0016
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
|
|
70567-0016
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
|
|
70567-0017
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
|
|
70567-0017
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
|
|
German ▼ 
English
Chinese
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand