| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd. |
70567-0140
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0140
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76關m (30關") Gold (Au) Selective Plating
|
|
70567-0141
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0141
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0142
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0142
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating,
|
|
70567-0143
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0143
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0144
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
|
70567-0144
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0146
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0146
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0147
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0147
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0148
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0148
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0149
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0149
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0120
|
1Mb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
|
|
70567-0125
|
1Mb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
|
|
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