| Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd. |
70567-0161
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits
|
|
70567-0161
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0162
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0162
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0163
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0163
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0164
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0164
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0165
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0165
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0167
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0167
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0168
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
70567-0168
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0169
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
|
70567-0169
|
40Kb/2P |
2.54mm Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76µm Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
10/04/2013 |
|
70567-0120
|
1Mb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
|
|
70567-0125
|
1Mb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating
|
|
70567-0131
|
1Mb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating
|
|
70567-0137
|
51Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
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