Hersteller | Teilenummer | Datenblatt | Bauteilbeschribung |
Molex Electronics Ltd. |
73656-1001
|
409Kb/7P |
2.00mm (.079") Pitch HDM Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle
|
73656-0000
|
355Kb/6P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關")
|
73656-0001
|
119Kb/3P |
2.00mm (.079
|
73656-0180
|
399Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 2 Circuits, Gold (Au) 0.76關m (30關")
|
73656-0181
|
396Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 2 Circuits, Tin
|
73656-0190
|
116Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 1 Circuits, Gold (Au) 0.76關m (30關")
|
73656-2000
|
413Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關")
|
73656-2001
|
409Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關")
|
73656-5000
|
403Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC
|
73656-5001
|
403Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關")
|